SNAP100x2 - Industrial sensor (weld inspection, industrial CT, NDT)

SNAP100x2 is a flexible solution for soft X-ray (<20 kVp for 0.75 mm CdTe) to hard X-ray (320+ kVp with 1.4 mm CdTe) imaging.

The larger width of the imaging area produce high quality images even in low flux applications and the dual channel design allows uninterrupted data capture.

Compact enclosure of the sensor is well suited for integration in applications requiring portability such as pipe weld inspection.

Despite the compact size, the device is temperature controlled for maximum performance.

Snap-150
Imaging Parameters and performance
Pixel technology Charge integration
Sensor thickness 0.75 mm or 1.4 mm CdTe
Pixel size 100 µm x 100 µm
Frame rate 10 to 300 fps
Configuration 2 colums of 4 hybrids each with 1.5 mm offset between columns
Active area size width: 2 x 5.7 mm height: 98 mm
Pixel depth @ 300 fps 12-bit
MTF @ RQA5: >70 % @ 2 lp/mm, >30 % @ 5 lp/mm
DQE @ RQA5: >80% @ 0 lp/mm, >60 % @ 2 lp/mm, >20 % @ 5 lp/mm
Enviromental conditions
Operating temperature range +10 to +40 °C
Operating Relative Humidity 10 - 90 %
Storage temperature range +5 to +45 °C
Transportation temperature range -30 to +50 °C (max 2 days)
Tube kV range 15 kV to 300 kV
Temperature control yes
Electrical interface
Data interface 1000BASE-T Ethernet
Interface Optoisolated I/O (5 V)
Power supply 24 V, ≤ 12 W without temperature control
≤ 60 W with temperature control
Physical dimensions
Width x lenght x height 175 mm x 285 mm x 100 mm (excluding heat sink assembly)
Weight 3 kg (without TCU)
Software
Software included Imaging application & Software Development Kit
Supported operating systems Windows 7 – 10 Pro 32-bit or 64-bit
dqe
mtf