SNAP100x2 is a flexible solution for soft X-ray (<20 kVp for 0.75 mm CdTe) to hard X-ray (320+ kVp with 1.4 mm CdTe) imaging.
The larger width of the imaging area produce high quality images even in low flux applications and the dual channel design allows uninterrupted data capture.
Compact enclosure of the sensor is well suited for integration in applications requiring portability such as pipe weld inspection.
Despite the compact size, the device is temperature controlled for maximum performance.
|Imaging Parameters and performance|
|Pixel technology||Charge integration|
|Sensor thickness||0.75 mm or 1.4 mm CdTe|
|Pixel size||100 µm x 100 µm|
|Frame rate||10 to 300 fps|
|Configuration||2 colums of 4 hybrids each with 1.5 mm offset between columns|
|Active area size||width: 2 x 5.7 mm height: 98 mm|
|Pixel depth @ 300 fps||12-bit|
|MTF @ RQA5:||>70 % @ 2 lp/mm, >30 % @ 5 lp/mm|
|DQE @ RQA5:||>80% @ 0 lp/mm, >60 % @ 2 lp/mm, >20 % @ 5 lp/mm|
|Operating temperature range||+10 to +40 °C|
|Operating Relative Humidity||10 - 90 %|
|Storage temperature range||+5 to +45 °C|
|Transportation temperature range||-30 to +50 °C (max 2 days)|
|Tube kV range||15 kV to 300 kV|
|Data interface||1000BASE-T Ethernet|
|Interface||Optoisolated I/O (5 V)|
|Power supply|| 24 V, ≤ 12 W without temperature control
≤ 60 W with temperature control
|Width x lenght x height||175 mm x 285 mm x 100 mm (excluding heat sink assembly)|
|Weight||3 kg (without TCU)|
|Software included||Imaging application & Software Development Kit|
|Supported operating systems||Windows 7 – 10 Pro 32-bit or 64-bit|