17 µm tall, 10 µm wide, Cu pillar bumping technology
suitable for pixel pitch as small as 19 µm
AJAT is a renowned design and manufacturing service provider for clients who wish to have a custom-made X-ray imaging component. Specifically we offer seamlessly the following services:
• full custom CMOS design
• PCB and read-out design
• thin films on 6″ and 8″ wafers
• wafer scale bumping (pitch 19 µm – 400 µm)
• wafer dicing
• flip-chip bonding and stack up testing
• fully automatic hybrid/die placement on PCBs or ceramics
• wire bonding
• final testing
Our relationships with our customers to bring advanced technology to the market and society stretches beyond our standard product range.
Over the years we have developed proprietary manufacturing processes. This knowledge has evolved into an ability to provide manufacturing services to our customers. Specifically hybridization of ASIC to CdTe, CdZnTe and Si detector substrates, testing (prior and post hybridization) and automatic hybrid (die) assembly and wire bonding to plurality of substrates.